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All EVENT RELEASE IR

2018.04.25
- Release
DMP releases AI processor “ZIA™ DV500” (in Japanese)
2017.12.04
- IR
- PDF
Results Briefing for the Fiscal Year Ending March 31, 2018 First Half
2017.05.26
- Release
DMP’s ZIA Classifier has been adopted for an automatic drive recorder video analysis service of Sumitomo Mitsui Auto Service Company, Limited (in Japanese)
2017.05.25
- IR
- PDF
Results Briefing for the Fiscal Year Ended March 31, 2017
2017.04.28
- Release
DMP AI Processor IP “ZIA™ DV700” Enables AI at the Edge
2017.01.20
- Event
Jon Pasona Tech Job Fair in Japan on Feb 4, 2017
2016.11.17
- IR
- PDF
Results Briefing for the Fiscal Year Ending March 31, 2017 First Half
2016.11.07
- Release
DMP launched “ZIA platform” making use of AI (in Japanese)
2016.05.17
- IR
- PDF
Results Briefing for the Fiscal Year Ended March 31, 2016
2016.01.12
- Release
DMP licenses GPU IP core “SMAPH®-F” for Renesas Electronics’ SoCs for Office Appliances
2015.04.20
- Release
iCatch Technology Licenses DMP GPU IP core
2015.02.07
- Release
DMP’s ant200 adopted for automotive equipment (in Japanese)
2014.10.14
- Release
DMP GPU IP core Adopted for Nintendo’s portable game console “New Nintendo 3DS”
2014.07.31
- Release
DMP Launches the world’s smallest GPU IP core for Wearables and Internet of Things(IoT)
2014.06.09
- Release
DMP Joins Altera’s Design Services Network Program
2014.04.23
- Release
Industry’s Highest Capacity SoC Interconnect IP Core from DMP Adopted by eSilicon
2014.04.04
- Release
DMP Expands Image Cognition Processor IP “APEX ICP” Sales to Taiwan Market
2014.01.16
- Release
Olympus adopts DMP’s Hybrid Graphics IP core for OLYMPUS OM-D E-M1
2013.10.12
- Release
Nintendo 2DS Adopts DMP’s graphics IP core
2013.06.12
- Release
DMP NAMES George Nakagami VP of Sales and Business Development
2013.05.29
- Release
FujiFilm Adopts DMP’s Graphics IP Core “SMAPH®-H”
2013.04.23
- Release
DMP 3D Graphics IP Core “SMAPH®-S” is selected by Renesas Electronics
2013.04.02
- Event
Japan IT Week Spring 2013
2012.11.21
- Event
DMP exhibited at Embedded Technology 2012
2012.11.06
- Release
DMP 3D Graphics IP Core “PICA®200 Lite” is adopted for OLYMPUS PEN Lite E-PL5 / OLYMPUS PEN mini E-PM2
2012.10.31
- Release
DMP Joins Heterogeneous System Architecture(HSA) Foundation to Contribute 3D Graphics and Common Compute Expertise
2012.08.07
- Release
DMP SMAPH®-S Products to Support OpenGL® ES 3.0 API Standard
2012.07.31
- Release
DMP 3D Graphics IP Core “PICA®200 Lite” is adopted for OLYMPUS Tough TG-1
2012.07.31
- Event
Meet DMP at SIGGRAPH 2012
2012.06.05
- Release
DMP Delivers New Platform IP Offering for Optimized SoC Integration with Graphics and Media Cores
2012.06.04
- Release
DMP and III Collaborate to Promote DMP’s Graphics Offering and GPU Integration Services to Taiwanese Customers
2012.05.21
- Event
Come to meet DMP at COMPUTEX
2012.05.07
- Release
DMP Introduces High-End OpenGL® ES 2.0 IP Cores and Multi-Core Configurations to Its SMAPH®-S Product Family
2012.04.17
- Event
DMP will exhibit at ESEC 2012
2012.04.17
- Event
DMP Sponsored Linley Tech Mobile Conference 2012
2012.03.06
- Release
Atrenta announced DMP has qualified their soft IP inclusion in the TSMC9000 IP library
2012.02.21
- Event
Meet DMP at GDC, March 5-9, 2012
2012.01.05
- Event
Meet DMP at CES 2012
2011.10.20
- Event
DMP exhibited at TSMC’s Open Innovation Platform Ecosystem Forum
2011.10.11
- Release
DMP Joins TSMC Soft IP Alliance
2011.08.26
- Event
DMP exhibited at SIGGRAPH 2011
2011.04.06
- Event
DMP will exhibit at ESEC 2011
2010.12.18
- Event
DMP will exhibit at SIGGRAPH ASIA 2010
2010.12.03
- Release
DMP demonstrates 3D/2D graphics IP core products at ET2010
2010.11.01
- Release
DMP and Xilinx Collaborate on Xilinx Alliance Program
2010.07.26
- Release
DMP Releases Android™ OpenGL® ES 3D Graphics E-learning Kit
2010.06.21
- Release
DMP 3D Graphics IP core “PICA®200” is adopted by Nintendo 3DS™
2010.04.01
- Release
DMP Licenses SMAPH®-F IP Cores to Renesas Electronics Corporation
2010.03.26
- Release
DMP demonstrates 3D/2D graphics IP core solutions at ESEC 2010
2010.03.17
- Release
MIPS Technologies and DMP Collaborate on Android™ Development for MIP® Architecture

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