Apr 06, 2012
DMP will exhibit at ESEC 2011

DMP has announced its participation at the “14th Embedded Systems Expo”, one of Japan’s largest embedded technology trade shows, which will be held in Tokyo Japanon May 11th – May 13th (booth#: W2-61 ).

DMP will demonstrate and present specialized solutions including OpenGL® ES 2.0 shader-based graphics IP core “SMAPH®-S”, “SMAPH®-F”(OpenVG™ 1.1 supported high-performance vector graphics IP core) , and “SMAPH®-H”(Vector/3D Hybrid IP) which meet the demands of various embedded UI(User Interface) applications.

DMP will also display, in collaboration with system-level design validation platform vendors, some reference platforms based on the DMP “PICA®200” 3D graphics IP core .