Product Overview
The Di1 SoM is a System on Module (SoM) designed for low-power edge AI cameras.
In addition to the SoC “Di1,” which is optimized for AI processing, it integrates memory (LPDDR4), storage (eMMC), and a power management circuit (PMIC) on a compact board. By mounting this SoM on a custom-designed baseboard and implementing only the required interfaces, customers can quickly commercialize edge AI camera products. This approach reduces the complexity of circuit design and contributes to shorter development cycles and earlier mass production.
Product Specifications
| Board dimensions (H × W × D) | 50㎜×55㎜×4.4㎜ |
|---|---|
| Main components | Di1 SoC, LPDDR4 (2 GB), eMMC (4 GB), various PMICs |
| Power supply | 5V input via DF40 connector; required voltages are generated within the SoM. 3.3 V / 1.8 V can be supplied to external circuits. |
| Connector | HIROSE DF40 (80 pin)×3 |
| Operating temperature | 0 to 70°C |
Provided Documents
- ・User’s Manual
- ・Application Notes
- ・Online Documentation
- ・Datasheets
Development Environment
Key Features
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1.High AI Processing Performance
Despite its compact size, the device delivers high-speed processing of AI algorithms through a proprietary NPU. It supports a wide range of advanced edge AI applications, from image recognition and object detection using CNNs and ViTs to inference processing for generative AI such as LLMs and VLMs.
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2.Low Power Consumption
Equipped with the “Di1” SoC, the module achieves outstanding energy efficiency as a SoM. This contributes to extended operating time for battery-powered products and to reducing overall operational costs of devices.
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3.High Versatility to Shorten Development Time
Provided as a SoM with all major components pre-mounted, it allows customers to concentrate on designing the interface sections.
