Mar 26, 2010
DMP demonstrates 3D/2D graphics IP core solutions at ESEC 2010

DMP has announced its participation at the “13th Embedded Systems Expo”, one of Japan’s largest embedded technology trade shows, which will be held in Tokyo Japan on May 12th – May 14th(booth#: E31-8). DMP will demonstrate and present specialized solutions including OpenGL® ES 2.0 shader-based graphics IP core “SMAPH®-S” and SMAPH®-F(OpenVG™ 1.1 supported high-performance vector graphics IP core) which meet the demands of various embedded UI(User Interface) applications. DMP will also display, in collaboration with MIPS Technologies, a reference platform based on a MIPS32® Malta™ development board and a DMP PICA®200 3D graphics IP-based GPU(NV7).

This exhibition has finished