Oct 15, 2009
DMP demonstrates 3D/2D graphics IP core products at ET2009

DMP has announced its participation at the “Embedded Technology 2009”, one of Japan’s largest embedded technology trade shows, which will be held in Yokohama Japan on November 18th – November 20th(booth#: B-02 ). DMP will demonstrate and present specialized solutions including new OpenGL® ES 2.0 shader-based graphics IP core “SMAPH®-S” and SMAPH®-F(High-performance vector graphics IP core) which meet the demands of various embedded UI(User Interface) applications. Our demos illustrate several combinations of IP cores, device targets(ASIC/FPGA etc) and middleware.

This exhibition has finished