Products & Services

PICA200

PICA®200 3D Graphics IP

PICA200 graphics IP core is a 3D graphics IP core for embedded applications with DMP’s proprietary extention MAESTRO that realizes a flexible, scalable, and innovative high quality graphics to meet broad demand for ASIC/ASSP/SoC (System on Chip) applications for the rapidly growing “21st-century Digital Consumer Market” such as amusement machines, car infotainment systems, mobile phones, game consoles, and digital appliances.

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PICA200

PC-grade sophistication and high-speed rendering on embedded devices

IPCOA

DMP offers the “DMP MAESTRO technology”,an advanced rendering extension that imple-ments various modeled CG algorithms as hardware. DMP MAESTRO technology not only allows for beautiful graphics and reduced content size and memory bandwidth, but also for reduced power consumption at the system level.

Tools for efficient content creation

pica200

DMP provides PICA emulators for PC environments, “ShaderBox®” which is an authoring support tool for DMP extensions, and content execution environments (engines). All these tools support the industry standard COLLADA specification, allowing for seamless workflow from major CG tools as well as efficient and low-cost production of contents that make full use of DMP extensions.

Main features / Specifications

  • Frame buffer: Maximum 4095×4095 pixels
  • Pixel format: RGBA4444, RGB565, RGBA5551, RGBA8888
  • Vertex program (ARB_vertex_program)
  • Render to texture
  • mipmap
  • Bilinear texture filtering
  • Alpha blending
  • Full-scene antialiasing (2×2)
  • Polygon offset
  • 8-bit stencil buffer
  • 24-bit depth buffer
  • Single/Double/Triple buffer
  • Vertex performance: Maximum 15.3M polygons/sec (at 200MHz)
  • Pixel performance: Maximum 800M pixels/sec (at 200MHz)

DMP MAESTRO technology

  • Per-pixel lighting
  • Procedural texture
  • Refraction mapping
  • Subdivision primitive
  • Shadow
  • Gaseous object rendering

Graphics chip development support service

Graphics chip

DMP, with its superior chip develop-ment expertise proven in the develop- ment of “ULTRAY2000” or the “NV7” 3D/2D graphics LSI for BloomTechno Inc., offers support service for the development of ASSPs/ASCPs with DMP’s graphics IP.

Case：BloomTechno Inc.

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