Products & Services
“PICA200″ 3D Graphics IP Core
Press Release: DMP 3D Graphics IP core “PICA200” is adopted by Nintendo 3DS™
“SMAPH-F” 3D Graphics IP Core
Press Release: DMP Licenses SMAPH-F IP Cores to Renesas Electronics Corporation
Over the past 15 years, BloomTechno Inc. (BloomTechno) has been pursuing all the key technologies concerning system controls, including LSI development, board design, software development, content development and sound development. From the standpoint of a plan content developer, the company provides integrated solutions covering development of display control software and development tools, optimization of circuit designs and determination of VDP* specifications and construction of circuits, basic software and development environments and production of plan content to maximize VDP function and performance.
※“VDP”: Video Display Processor. These are installed in amusement devices for video output.
“PICA200″ 3D Graphics IP Core
NV7, a 3D/2D high-performance graphics LSI
DMP and BloomTechno jointly developed NV7, a 3D/2D high-performance graphics LSI equipped with PICA200. BloomTechno distributes image system units with NV7 incorporated to amusement device manufacturers.
PICA Graphics IP Core has been designed to flexibly adapt to diversified applications. By incorporating PICA®200 into NV7, the industry’s most competitive graphics LSI has been developed, meeting the demands of the amusement industry, including low power consumption, support for high-speed character animation and a highly advanced shader capability as well as support for movie CODECs.


Examples of entertainment content created using NV7
Mr. Yoshihiro Nomura, President of BloomTechno Inc.
As can be seen with the winning of the IP Award, PICA has received great recognition. However, I believe that the fact that it has actually proven both its low-power consumption and high performance in NV7, our next-generation 3D/2D graphics LSI, will surely have a great impact on the world of embedded graphics.