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DMP Advanced Solution
Mobile
Home Electronics
Car Electronics
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For Embedded Device Graphics IP Core
Specs of Graphics IP Core
SMAPH®-S 3D Graphics IP High-performance, lowest power consumption, optimized OpenGL ES 2.0
PICA®200 3D Graphics IP PC-grade sophistication and high-speed rendering in embedded device
PICA®200 Lite 3D Graphics IP Realizes a high performance and high quality 3D graphics UI
PICA®200 for FPGA 3D Graphics IP Industry's first IP so lution for FPGA with full 3D graphics
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Press Releases
2010.07.26.
DMP Releases Android™ OpenGL ES 3D Graphics E-learning Kit
Press Releases
2010.06.21.
Press Release: DMP 3D Graphics IP core "PICA200" is adopted by Nintendo 3DS™
Press Releases
2010.04.01.
DMP Licenses SMAPH-F IP Cores to Renesas Electronics Corporation
Android 3D Graphics Learning Kit
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