“SMAPH-S” is the world’s smallest and most scalable OpenGL ES 2.0 IP core and sets a new benchmark for mobile to high performance computing devices
DMP today announced “SMAPH-S”, a next generation OpenGL ES 2.0 shader-based graphics IP core. DMP will start providing the core to initial customers in 1Q 2010.
SMAPH-S is a high-performance 3D graphics IP core that offers industry lowest power consumption with its state-of-the-art power saving technologies and highly optimized OpenGL ES 2.0 based-shader pipelines. SMAPH-S meets the widespread demand for ASIC/ASSP/SoC applications including mobile devices, consumer electronics, automotive, industry, game consoles, and entertainment devices. With its support of scalable shader architecture, the total number of the geometry and pixel processors can be configured from as small as 2 for entry level mobile devices, up to 24 for high performance devices.
SMAPH-S will be compliant with OpenGL ES 2.0 and fully supports the popular OpenGL ES 1.1, and OpenVG 1.1 standards.
SMAPH-S supports industry standard OCP and AMBA AXI bus interconnect as well as DMP’s proprietary architecture such as optimized cache structure for memory interfaces, which make it easy to integrate the IP into SoC, and achieve system level performance goals in real life implementations.
DMP continues to work with 3rd party middleware tool vendors and offers a variety of content creation tool chains to meet the wide range of needs for different types of application development.
DMP will exhibit SMAPH-S at the “Embedded Technology 2009”, one of Japan’s largest embedded technology trade shows, which will be held in Yokohama, Japan on November 18th – November 20th.
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